通過新flow E1&E2模塊，Vincotech增加了諸多創新功能，例如通過預彎DCB實現的flow封裝技術，已經現場驗證成功。flow E1&E2封裝可與散熱器發生良好的熱接觸。
封裝尺寸：
flow E1
高度：12mm
寬度：62mm
深度：34mm
flow E2
高度：12mm
寬度：63mm
深度：58mm
特點：
12mm低感應標準工業封裝
凸型基材可實現良好的熱接觸
緊湊型設計
CTI600封裝材料
熱機械推拉力釋放
預彎DCB可與散熱器發生良好的熱接觸
壓接引腳帶泄壓區
可選相變材料
優勢：
與業內其他同類產品相比，熱力性能卓越，Rth降低25%，可靠性更高，功率輸出更高
新IGBT M7的芯片級多重采購可確保芯片的供應
（凸面DCB可與散熱器發生良好的熱接觸）
（翻譯校對：Jacky Wu, 責任編輯：Anna Chai）
With the new flow E1&E2 modules Vincotech has added innovated features like the successfully field proven flow package technology with the pre-bent DCB. flow E1&E2 packages have been designed to offer an excellent thermal contact to the heat sink.
Housing dimensions：
flow E1
Height: 12 mm
Width: 62 mm
Depth: 34 mm
flow E2
Height: 12 mm
Width: 63 mm
Depth: 58 mm
Features：
12 mm low-inductive standard industrial package
Convex shaped substrate for superior thermal contact
Compact design
CTI600 housing material
Thermo-mechanical push-and-pull force relief
Pre-bent DCB for excellent thermal contact to heat sink
Press-fit pins with stress-relive zone
Optional Phase-change material
Benefits：
Superior thermal performance with 25% lower Rth compered to competition for higher reliability and higher power output
Multiple source on chip level with the new IGBT M7 enables a secure supply of chips
（Convex DCB for optimal thermal contact to the heat sink）
